Semiconductor devices - Mechanical and climatic test methods - Bond strength

Standard [CURRENT]

BS EN 60749-22:2003-07-04

Semiconductor devices - Mechanical and climatic test methods - Bond strength

German title
Halbleiterbauelemente - Mechanische und klimatische Pruefverfahren - Kontaktfestigkeit (Bond strength)
Publication date
2003-07-04
Accessibility
Original language
English
Pages
24

from 298.10 EUR VAT included

from 278.60 EUR VAT excluded

Format and language options

PDF download

  • 298.10 EUR

Shipment (3-5 working days)

  • 331.60 EUR

Monitor with the Standards Ticker

This option is only available after login.
Easily subscribe: Save time and money now!

You can also subscribe to this document - together with other important standards in your industry. This makes your work easier and pays for itself after a short time.

Sparschwein_data
Subscription advantages
Sparschwein Vorteil 1_data

Important standards for your industry, regularly updated

Sparschwein Vorteil 2_data

Much cheaper than buying individually

Sparschwein Vorteil 3_data

Useful functions: Filters, version comparison and more

Publication date
2003-07-04
Original language
English
Pages
24
Loading recommended items...

Product information on this site:

Quick delivery via download or delivery service

Buy securely with a credit card or pay upon receipt of invoice

All transactions are encrypted

Replacement amendments

This document has been partially replaced by BS EN IEC 60749-22-2:2026-01-21 and partially replaced by BS EN IEC 60749-22-1:2026-01-21 .

Loading recommended items...