Standard [CURRENT]
DIN EN 60191-6-22:2013-08
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 60191-6-22:2012); German version EN 60191-6-22:2013
- German title
- Mechanische Normung von Halbleiterbauelementen - Teil 6-22: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Konstruktionsleitfaden für Halbleitergehäuse Si-Feinraster-Ball-Grid-Array und Si-Feinraster-Land-Grid-Array (S-FBGA und S-FLGA) (IEC 60191-6-22:2012); Deutsche Fassung EN 60191-6-22:2013
- Publication date
- 2013-08
- Original language
- German
- Pages
- 18
- Publication date
- 2013-08
- Original language
- German
- Pages
- 18
- DOI
- https://dx.doi.org/10.31030/2015842
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Overview
The DIN EN 60191-6 standard series is based on the corresponding International Standards of the IEC 6019-6 series. It specifies rules for outline drawings of surface-mounted semiconductor device packages in the various outline and termination designs which are applied for computerized design and manufacturing process. This part of DIN EN 60191 contains the symbols and associated specifications for outline drawings and dimensions of the device packages to be used, including the terminations, common to all siliconbased package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA). The responsible committee is DKE/UK 631.4 "Gehäuse für Halbleiterbauelemente" ("Packages for semiconductor devices") of the DKE (German Commission for Electrical, Electronic and Information Technologies) at DIN and VDE.