Solderless connections - Part 8: Compression mount connections - General requirements, test methods and practical guidance (IEC 60352-8:2011); German version EN 60352-8:2011

Standard [CURRENT]

DIN EN 60352-8:2011-12

Solderless connections - Part 8: Compression mount connections - General requirements, test methods and practical guidance (IEC 60352-8:2011); German version EN 60352-8:2011

German title
Lötfreie Verbindungen - Teil 8: Druckmontage-Verbindungen - Allgemeine Anforderungen, Prüfverfahren und Anwendungshinweise (IEC 60352-8:2011); Deutsche Fassung EN 60352-8:2011
Publication date
2011-12
Original language
German
Pages
23

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Publication date
2011-12
Original language
German
Pages
23
DOI
https://dx.doi.org/10.31030/1813694
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Overview

This standard specifies requirements and tests for compression mount connections with metallic spring contacts. Furthermore it contains practical guidance information and information on materials and data from industrial experience. A compression mount connection is a solderless connection between a compression mount contact and a contact pad which is established by a continuous compression force. The responsible Committee is K 651 "Steckverbinder" ("Connectors") of the DKE (German Commission for Electrical, Electronic and Information Technologies) of DIN and VDE.

ICS

31.220.10

DOI

https://dx.doi.org/10.31030/1813694

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