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Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2008); German version EN 60749-37:2008

Standard [WITHDRAWN]

DIN EN 60749-37:2008-08

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2008); German version EN 60749-37:2008

German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 37: Prüfverfahren Fall der Leiterplatte unter Verwendung eines Beschleunigungs-Messgerätes (IEC 60749-37:2008); Deutsche Fassung EN 60749-37:2008
Publication date
2008-08
Original language
German
Pages
22

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Publication date
2008-08
Original language
German
Pages
22
DOI
https://dx.doi.org/10.31030/1443206

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ICS

31.080.01

DOI

https://dx.doi.org/10.31030/1443206
Replacement amendments

This document has been replaced by: DIN EN IEC 60749-37:2023-12 .

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