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Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 61191-3:2017); German version EN 61191-3:2017

Standard [CURRENT]

DIN EN 61191-3:2018-05

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 61191-3:2017); German version EN 61191-3:2017

German title
Elektronikaufbauten auf Leiterplatten - Teil 3: Rahmenspezifikation - Anforderungen an gelötete Baugruppen in Durchsteckmontage (IEC 61191-3:2017); Deutsche Fassung EN 61191-3:2017
Publication date
2018-05
Original language
German
Pages
21

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Publication date
2018-05
Original language
German
Pages
21
DOI
https://dx.doi.org/10.31030/2775609
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ICS

31.240

DOI

https://dx.doi.org/10.31030/2775609
Replacement amendments

This document replaces DIN EN 61191-3:1999-06 .

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