We use cookies to make our websites more user-friendly and to continuously improve them. If you continue to use the website, you consent to the use of cookies. You can find more information in our privacy statement and our cookie guidelines.

To our valued customers,

At last: 

Beuth Verlag is now DIN Media. 

You can find out more about our new name and the reasons behind it here.

To use our new website without any hiccups, please clear your browser cache. 

Yours sincerely,

DIN Media

Standards Worldwide
Standards Worldwide
Phone +49 30 58885700-07

Standard [CURRENT]

DIN EN IEC 60191-1:2018-10

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2018); German version EN IEC 60191-1:2018

German title
Mechanische Normung von Halbleiterbauelementen - Teil 1: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von Einzelhalbleiterbauelementen (IEC 60191-1:2018); Deutsche Fassung EN IEC 60191-1:2018
Publication date
2018-10
Original language
German
Pages
41

Please select

from 141.20 EUR VAT included

from 131.96 EUR VAT excluded

Purchasing options

PDF download

  • 141.20 EUR

Shipment (3-5 working days)

  • 170.60 EUR

Standards Ticker 1
1

Learn more about the standards ticker

Publication date
2018-10
Original language
German
Pages
41
DOI
https://dx.doi.org/10.31030/2867448

Product information on this site:

Quick delivery via download or delivery service

Buy securely with a credit card or pay upon receipt of invoice

All transactions are encrypted

ICS
01.100.25, 31.240
DOI
https://dx.doi.org/10.31030/2867448
Replacement amendments

This document replaces DIN EN 60191-1:2007-11 .

Cooperation at DIN

Relationship to other standards
This document references:
Loading recommended items...
Loading recommended items...
Loading recommended items...
Loading recommended items...