DIN EN IEC 60384-23:2024-05

This part of IEC 60384 is applicable to fixed surface mount capacitors for direct current, with metallized electrodes and polyethylene naphthalate dielectric for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted directly onto substrates for hybrid circuits or onto printed boards. These capacitors may have "self-healing properties" depending on conditions of use. They are primarily intended for applications where the a.c. component is small with respect to the rated voltage. This part of IEC 60384 specifies the preferred ratings and characteristics for the type of capacitor described, selects the appropriate quality assessment procedures, tests and measurement methods from IEC 60384-1:2021 and gives general requirements for operating performance. In detail specifications referencing this sectional specification, the severity levels of tests and requirements shall be at least those specified in this specification; weaker ones are not permitted. Capacitors for radio interference suppression are not included, but are covered by IEC 60384-14. The standard differs from DIN EN 60384-23:2016-02 as follows: a) this edition contains the following significant technical changes compared to the previous edition: the entire document has been revised based on the ISO/IEC guidelines, Part 2:2018 and harmonization with other similar types of documents; b) the document structure has been organized to be consistent with the new sectional specification decided in TC 40; c) the tables and Clause 5 have been revised to avoid repetitions and contradictions; d) the tables for batch and periodic tests, including the requirements, have been moved to Annex A; e) in Subclause 5.5 (Shear test), Subclauses 5.5.1 and 5.5.2 have been added; f) in Subclause 5.14 (Solvent resistance of the component), Subclauses 5.14.1 and 5.14.2 have been added; in Table 8 and Table A.2, test 5.14 has been added before 5.7.5 (Final tests and requirements) in group 1A and in subgroup C1; g) In Subclauses 5.15 (Solvent resistance of marking), Subclauses 5.15.1 and 5.15.2 have been added; h) the tangent of the loss angle of a capacitor has been added to the soldering heat resistance test; i) The test level (IL) of subgroup A1 has been revised. The document increases investment security for manufacturers and users through its application and provides test laboratories and manufacturers with defined information on testing, and product compatibility between manufacturers is improved.