Thermal-links - Requirements and application guide (IEC 60691:2023 + AMD1:2024); German version EN IEC 60691:2023 + A1:2024

Standard [CURRENT]

DIN EN IEC 60691:2025-12

VDE 0821:2025-12

Thermal-links - Requirements and application guide (IEC 60691:2023 + AMD1:2024); German version EN IEC 60691:2023 + A1:2024

German title
Temperatursicherungen - Anforderungen und Anwendungshinweise (IEC 60691:2023 + AMD1:2024); Deutsche Fassung EN IEC 60691:2023 + A1:2024
Publication date
2025-12
Accessibility
Original language
German
Pages
57

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Publication date
2025-12
Original language
German
Pages
57
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Overview

This International Standard is applicable to thermal-links intended for incorporation in electrical appliances, electronic equipment and component parts thereof, normally intended for use indoors, in order to protect them against excessive temperatures under abnormal conditions. The equipment is not designed to generate heat. The effectiveness of the protection against excessive temperatures logically depends upon the position and method of mounting of the thermal-link, as well as upon the current which it is carrying. This document may be applicable to thermal-links for use under conditions other than indoors, provided that the climatic and other circumstances in the immediate surroundings of such thermal-links are comparable with those in this standard. This document may be applicable to thermal-links in their simplest forms (for example, melting strips or wires), provided that molten materials expelled during function cannot adversely interfere with the safe use of the equipment, especially in the case of hand-held or portable equipment, irrespective of its position. Annex H of this standard is applicable to thermal-link packaged assemblies where the thermal-link(s) has already been approved to this standard but packaged in a metallic or non-metallic housing and provided with terminals/wiring leads. This standard is applicable to thermal-links with a rated voltage not exceeding 690 V a.c. or d.c. and a rated current not exceeding 63 A. The objectives of this standard are: to establish uniform requirements for thermal-links, to define methods of test, to provide useful information for the application of thermal-links in equipment. This standard is not applicable to thermal-links used under extreme conditions such as corrosive or explosive atmospheres. This standard is not applicable to thermal-links to be used in circuits on a.c. with a frequency lower than 45 Hz or higher than 62 Hz. The standard differs from DIN EN IEC 60691 (VDE 0821):2024-04 as follows: a) requirements for thermal-link packaged assemblies; b) renew the requirements and definitions for Th-test. Application of this document increases investment security for manufacturers and users while providing testing laboratories and manufacturers with concrete information for testing.

Replacement amendments

Cooperation at DIN