Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices (IEC 60747-15:2024); German version EN IEC 60747-15:2024

Standard [CURRENT]

DIN EN IEC 60747-15:2025-08

Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices (IEC 60747-15:2024); German version EN IEC 60747-15:2024

German title
Halbleiterbauelemente - Teil 15: Einzel-Halbleiterbauelemente - Isolierte Leistungshalbleiter (IEC 60747-15:2024); Deutsche Fassung EN IEC 60747-15:2024
Publication date
2025-08
Accessibility
Original language
German
Pages
60

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Publication date
2025-08
Original language
German
Pages
60
DOI
https://dx.doi.org/10.31030/3621881
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Overview

This part of IEC 60747 contains the requirements for isolated power semiconductor devices. These requirements apply in addition to the requirements given in other parts of IEC 60747 for non-isolated power semiconductor devices and in parts of IEC 60748 for ICs. There are no restrictions on the scope of this document. The standard differs from DIN EN 60747-15:2012-08 as follows: a) intelligent power semiconductor modules (IPMs) that were previously excluded in the first and second editions are now included in this document (Annex C); b) thermal resistance is described for each switch (6.2.4); c) a test of the insulation between the temperature sensor and the terminals as agreed with the user has been added (6.1.2). Application of this document increases investment security for manufacturers and users, provides testing laboratories and manufacturers with defined information for testing, and enhances product compatibility between manufacturers.

ICS

31.080.01

DOI

https://dx.doi.org/10.31030/3621881
Replacement amendments

This document replaces DIN EN 60747-15:2012-08 .

Cooperation at DIN

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