Standard [CURRENT]
DIN EN IEC 61189-2-720:2025-01
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance (IEC 61189-2-720:2024); German version EN IEC 61189-2-720:2024
- German title
- Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 2-720: Erkennung von Fehlern in Verbindungsstrukturen durch Messung der Kapazität (IEC 61189-2-720:2024); Deutsche Fassung EN IEC 61189-2-720:2024
- Publication date
- 2025-01
- Original language
- German
- Pages
- 12
- Publication date
- 2025-01
- Original language
- German
- Pages
- 12
- DOI
- https://dx.doi.org/10.31030/3567397
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Overview
This part of IEC 61189 provides a method to evaluate specific characteristics of circuit boards by measuring the capacitance between conductor traces and a ground plane and can be used for qualitative comparison of a test specimen to a reference board. This document covers: purpose, test specimen, test method, test report, test schedule, and test results. This method is not intended for quantitative measurements and for assessment of conformity to a specification. By applying this document, manufacturers and users can increase their investment security, and testing laboratories and manufacturers are provided with defined information for testing.