Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300 (IEC 61189-2-804:2023); German version EN IEC 61189-2-804:2023

Standard [CURRENT]

DIN EN IEC 61189-2-804:2024-10

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300 (IEC 61189-2-804:2023); German version EN IEC 61189-2-804:2023

German title
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 2-804: Prüfverfahren für die Zeit bis zur Delaminierung - T260, T288, T300 (IEC 61189-2-804:2023); Deutsche Fassung EN IEC 61189-2-804:2023
Publication date
2024-10
Original language
German
Pages
10

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Publication date
2024-10
Original language
German
Pages
10
DOI
https://dx.doi.org/10.31030/3552509
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Overview

This part of IEC 61189 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyzer (TMA). Temperatures used for this evaluation are typically 260°C, 288°C and 300ºC, but are not limited to these values. Its application increases investment security for manufacturers and users, and provides testing laboratories and manufacturers with defined information for testing.

ICS

31.180

DOI

https://dx.doi.org/10.31030/3552509

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