Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
German title
Mechanische Normung von Halbleiterbauelementen - Teil 4: Kodierungssystem für Gehäuse und Eingruppierung der Gehäuse nach der Gehäusebauform für Halbleiterbauelemente
Publication date
1999-10
Original language
English,
French
Pages
39
Publication date
1999-10
Original language
English,
French
Pages
39
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Replacement amendments
This document has been modified by: IEC 60191-4 AMD 1:2001-11,IEC 60191-4 AMD 2:2002-07