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IEC 60191-6-18:2010-01
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
- German title
- Mechanische Normung von Halbleiterbauelementen - Teil 6-18: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Konstruktionsleitfaden für Ball-Grid-Array (BGA)
- Publication date
- 2010-01
- Original language
- English, French
- Pages
- 40
- Publication date
- 2010-01
- Original language
- English, French
- Pages
- 40
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Replacement amendments
This document has been modified by: IEC 60191-6-18 Corrigendum 1:2010-05,IEC 60191-6-18 Corrigendum 2:2010-07
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