Mechanical standardization of semiconductor devices; part 6: general rules for the preparation of outline drawings of surface mounted semiconductor device packages
German title
Mechanische Normung von Halbleiterbauelementen; Teil 6: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen
Publication date
1990-12
Accessibility
Original language
English,
French
Pages
37
Publication date
1990-12
Original language
English,
French
Pages
37
Loading recommended items...
Product information on this site:
Quick delivery via download or delivery service
Buy securely with a credit card or pay upon receipt of invoice
All transactions are encrypted
Replacement amendments
This document has been modified by: IEC 60191-6 AMD 1:1999-12