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IEC 60749-20 Corrigendum 1:2003-08
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
- German title
- Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20: Beständigkeit kunststoffverkappter oberflächenmontierbarer Bauelemente (SMD) gegenüber der kombinierten Beanspruchung von Feuchte und Lötwärme
- Publication date
- 2003-08
- Accessibility
- Original language
- English, French
- Publication date
- 2003-08
- Original language
- English, French
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