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IEC 60749-21:2005-10

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 21: Lötbarkeit
Publication date
2005-10
Accessibility
Original language
English, French
Pages
54
Publication date
2005-10
Original language
English, French
Pages
54
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