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IEC 60749-35:2006-07

Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components

German title: Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 35: Ultraschallmikroskopie für kunststoffverkappte Bauelemente der Elektronik
Publication date: 2006-07
Original language: English, French
Pages: 43

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