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IEC 61188-6-2:2021-02
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
- German title
- Leiterplatten und Flachbaugruppen - Konstruktion und Anwendung - Teil 6-2: Anschlussflächenbild - Beschreibung des Anschlussflächenbilds für die meisten oberflächenmontierbaren Bauelemente (SMD, en: surface mounted components)
- Publication date
- 2021-02
- Original language
- English, French
- Pages
- 49
- Publication date
- 2021-02
- Original language
- English, French
- Pages
- 49
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