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IEC 61189-11:2013-05

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys

German title: Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 11: Messung der Schmelztemperatur und Schmelztemperaturbereiche von Lotlegierungen
Publication date: 2013-05
Original language: English, French
Pages: 30

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