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IEC 61190-1-3 AMD 1:2010-06
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
- German title
- Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-3: Anforderungen an Elektroniklote und an Festformlote mit oder ohne Flussmittel für das Löten von Elektronikprodukten
- Publication date
- 2010-06
- Original language
- English, French
- Pages
- 17
- Publication date
- 2010-06
- Original language
- English, French
- Pages
- 17
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