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IEC 61191-3:1998-08

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

German title
Elektronikaufbauten auf Leiterplatten - Teil 3: Rahmenspezifikation - Anforderungen an gelötete Baugruppen in Durchsteckmontage
Publication date
1998-08
Original language
English, French
Pages
31
Publication date
1998-08
Original language
English, French
Pages
31
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