Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
German title
Halbleiterbauelemente - Umwelt- und Dauerprüfung - Prüfverfahren für in Oberflächenmontagetechnik bestückte Leiterplatten mit Area-Array-Bauelementen der Bauformen FBGA, BGA, FLGA, LGA, SON und QFN.
Publication date
2004-07
Accessibility
Original language
English
Pages
32
Publication date
2004-07
Original language
English
Pages
32
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Replacement amendments
This document has been modified by: IEC 62137 Corrigendum 1:2005-01