Design Standard for Printed Electronics on Rigid Substrates

Standard [CURRENT]

IPC 2294:2024-06-01

Design Standard for Printed Electronics on Rigid Substrates

Publication date
2024-06-01
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Original language
English
Pages
52

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Publication date
2024-06-01
Original language
English
Pages
52
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Short description

IPC-2294 standard establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on rigid substrates. Rigid substrates, as applies to IPC-2294 standard, are those that are not required to be flexed into a new shape for the purposes of assembly or operation. The rigid substrate can be conductive (e. g., rigid printed board or assembly), semiconductive or nonconductive.
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