Specification for Base Materials for Rigid and Multilayer Printed Boards

Standard [CURRENT]

IPC 4101F:2026-02-01

Specification for Base Materials for Rigid and Multilayer Printed Boards

Publication date
2026-02-01
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Original language
English
Pages
168

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Publication date
2026-02-01
Original language
English
Pages
168
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Short description

This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic circuits. The purpose of this standard is to classify and characterize base materials for use in rigid and multilayer boards for electronic applications. It is to be used for procurement and quality assurance activities.