Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

Standard [CURRENT]

IPC 4552B:2021-04-01

Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

Publication date
2021-04-01
Original language
English
Pages
156

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Publication date
2021-04-01
Original language
English
Pages
156
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Short description

IPC-4552B standard sets the requirements for Electroless Nickel / Immersion Gold (ENIG) deposit thickness for applications including soldering, wire bonding, and as a contact finish. IPC-4552B standard is used to specify acceptance criteria to meet performance standards for IPC-6010 family of documents including IPC-6012, IPC-6013 and IPC-6018. The ENIG deposit specified using this document will meet the highest coating durability rating as specified in IPC-J-STD-003 printed board solderability specification.
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