Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards

Standard [CURRENT]

IPC 4555:2022-04-01

Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards

Publication date
2022-04-01
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Original language
English
Pages
24

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Publication date
2022-04-01
Original language
English
Pages
24
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Short description

The IPC-4555 standard covers the requirements and testing for organic solderability preservatives (OSP) processes for printed boards to be used primarily for electrical and electronic circuits. Details for lead free soldering are covered in IPC-4555.