Resin Coated Copper Foil for Printed Boards Guideline

Standard [CURRENT]

IPC 4563:2008-02-11

Resin Coated Copper Foil for Printed Boards Guideline

Publication date
2008-02-11
Original language
English
Pages
19

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Publication date
2008-02-11
Original language
English
Pages
19
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Short description

This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies. 19 pages. Released November 2007.Included in the IPC-C-105, IPC-C-107 and the IPC-C-1000 Collections.
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