Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

Standard [CURRENT]

IPC 4821:2006-06-12

Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

Publication date
2006-06-12
Original language
English
Pages
34

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Publication date
2006-06-12
Original language
English
Pages
34
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Short description

This document describes materials that can be used for the fabrication of embedded passive capacitor devices within the finished printed circuit board substrate. For this document, embedded passive devices and the phrase embedded passives are considered to be equivalent. It provides information on general designations and associated characteristics of embedded passive device (EPD) capacitor materials. The document shall be used as a qualification and conformance standard for these materials. This document contains material designation, conformance (requirements), qualification (characterization) and quality assurance specifications. This document covers the requirements for dielectric, conductive, and insulating materials that are used with materials for the manufacture of printed circuit boards containing embedded passive capacitor functionality. 34 pages. Released May 2006. Included in the IPC-C-105, IPC-C-107 and the IPC-C-1000 Collections.
Replacement amendments

This document has been modified by: IPC 4821 AMD 1:2010-04

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