Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures

Standard [CURRENT]

IPC 6015:1998-02-01

Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures

Publication date
1998-02-01
Original language
English
Pages
25

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Publication date
1998-02-01
Original language
English
Pages
25
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Short description

Establishes the specific requirements for organic mounting structures used to interconnect chip components, which in combination form the completed functional organic single-chip module (SCM-L) or organic multichip module (MCM-L) assembly. Includes the quality and reliability assurance requirements that must be met for their acquisition. For use with IPC-6011. 25 pages. Released February 1998. Included in the 6010 Series.
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