Space and Military Avionics Applications Addendum to IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

Standard [CURRENT]

IPC 6018DS:2022-08-01

Space and Military Avionics Applications Addendum to IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

Publication date
2022-08-01
Original language
English
Pages
20

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Publication date
2022-08-01
Original language
English
Pages
20
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Short description

The IPC-6018DS addendum supplements or replaces specifically identified requirements of IPC-6018D, for high frequency (microwave) printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics. The IPC-6018DS addendum incorporates new requirements in areas such as copper wrap plating, dewetting, pad/land anomalies, copper cap plating of filled holes, copper filled microvias and therma shock. For use with IPC-6011 and IPC-6018.
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