Design and Assembly Process Implementation of 3D Components

Standard [CURRENT]

IPC 7091A:2023-01-01

Design and Assembly Process Implementation of 3D Components

Publication date
2023-01-01
Original language
English
Pages
104

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Publication date
2023-01-01
Original language
English
Pages
104
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Short description

This document describes the design and assembly challenges and ways to address those challenges for implementing 3D component technology. Recognizing the effects of combining multiple uncased semiconductor die elements in a single-package format can impact individual component characteristics and can dictate suitable assembly methodology. The information contained in this standard focuses on achieving optimum functionality, process assessment, end-product reliability and repair issues associated with 3D semiconductor package assembly and processing.
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