Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Conductors

Standard [NEW]

IPC EIA/JEDEC J-STD-002F:2026-06-01

Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Conductors

Publication date
2026-06-01
Accessibility
Original language
English
Pages
60

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Publication date
2026-06-01
Original language
English
Pages
60
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Short description

IPC-J-STD-002F prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs, and tabs. The IPC-J-STD-002E standard also includes a test method for the resistance to dissolution/dewetting of metallization. IPC-J-STD-002F is intended for use by both supplier and user. The IPC-J-STD-002F standard was developed by ECIA, IPC and JEDEC.
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