IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

Standard [CURRENT]

IPC JEDEC 9703:2009-03-18

IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

Publication date
2009-03-18
Accessibility
Original language
English
Pages
42

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Publication date
2009-03-18
Original language
English
Pages
42
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Short description

Establishes mechanical drop and shock and test guidelines for assessing solder joint reliability of printed board assemblies from system to component level. This document addresses methods to define mechanical shock use-conditions, methods to define system level, system printed board level and component test board level testing that correlate to such use conditions and guidance on the use of experimental metrologies for mechanical shock tests. 42 pages. Released March 2009. Included in the C-103 and C-1000 Collections.