Guidelines for Chip-on-Board Technology Implementation

Standard [CURRENT]

IPC SM-784:1990-11-01

Guidelines for Chip-on-Board Technology Implementation

Publication date
1990-11-01
Original language
English
Pages
37

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Publication date
1990-11-01
Original language
English
Pages
37
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Short description

Discusses chip types, board selection, design issues and thermal transfer methods for Chip on Board (COB) applications. Details wire bonding, TAB and flip chip designs and provides information on mounting materials, including adhesives, wires and various mechanical bonding techniques.
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