Terms and Definitions for Interconnecting and Packaging Electronic Circuits

Standard [CURRENT]

IPC T-50P:2025-11-01

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

Publication date
2025-11-01
Original language
English
Pages
106

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Publication date
2025-11-01
Original language
English
Pages
106
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Short description

This document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing English as a second language could understand the subtleties of the meaning. Revision P contains over 120 new or revised terms, including new terminology for back-drill structures, cable and wire harnesses, board packaging, sintered interconnects, soldering, fabrication processes and testing.
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