Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011) (german version)

Standard [CURRENT]

OEVE/OENORM EN 62047-12:2012-08-01

Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011) (german version)

German title
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 12: Verfahren zur Prüfung der Biege-Ermüdungsfestigkeit von Dünnschichtwerkstoffen unter Verwendung der Resonanzschwingungen bei MEMS-Strukturen (IEC 62047-12:2011) (deutsche Fassung)
Publication date
2012-08-01
Accessibility
Original language
German
Pages
31

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Publication date
2012-08-01
Original language
German
Pages
31
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