RESIN, POLYIMIDE, LAMINATING AND MOLDING High Temperature Resistant, 370°C (700°F) Unfilled, Addition Polymer
Publication date
2011-08-09
Original language
English
Pages
9
Publication date
2011-08-09
Original language
English
Pages
9
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Short description
This specification covers a single-component, unfilled, heat-reactive, thermosetting, acetylene-substituted, aromatic-polyimide resin in the form of dry solid powder or particles. The resin thermally cures to a polyimide polymer.