Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (P-PFBGA and P-PFLGA)
German title
Mechanische Normung von Halbleiterbauelementen - Teil 6-17: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Konstruktionsleitfaden für gestapelte Gehäuse - Feinraster-Ball-Grid-Array und Feinraster-Land-Grid-Array (P-PFBGA/PPFLGA)
Publication date
2011-04
Accessibility
Original language
German
Pages
27
Publication date
2011-04
Original language
German
Pages
27
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