Mechanical standardization of semiconductor devices. Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

Standard [CURRENT]

SN EN 60191-6-4:2003-07

Mechanical standardization of semiconductor devices. Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

German title
Mechanische Normung von Halbleiterbauelementen. Teil 6-4: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Messverfahren für Gehäusemasse von Ball Grid Array (BGA)
Publication date
2003-07
Accessibility
Original language
German
Pages
19

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Publication date
2003-07
Original language
German
Pages
19
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