ANSI Approved. This is the first revision to the industry's first consensus document on calculating benchmark indices for defects and quality. The document provides consistent methodologies for ...

Covers the information requirements for the procurement of material, box build, assembly, system integration, inspection, test, burn-in, delivery and/or distribution of electronic assemblies. 5 pages.

This guideline addresses the major factors influencing the design of high-speed circuitry. Considerations include electrical noise, electromagnetic interference, signal propagation time ...

Covers the nomenclature, definitions and requirements for reinforcement made from nonwoven para-aramid fibers. Para-aramid reinforcement is primarily used in PCBs for HDI and high speed/high ...

Residues on printed circuit boards are directly related to the reliability of the produced hardware and can result in serious failures if not known or monitored. The IPC-5701 provides guidance ...

ANSI Approved. This document addresses the implementation of optical and optoelectronic packaging technologies. The areas discussed include: technology choices, design considerations, material ...

The purpose of this specification is to define standard practices for handling various kinds of optical fiber and to define the specifications and guidelines to be used in the design of carriers ...

This standard establishes mechanical outline requirements for devices supplied in flip chip or Chip Size Package (CSP) formats, including die surface, die terminals, and interconnection ...

This standard describes a data format for transmitting bare board electrical test information in digital form, including data suitable for computer-aided repair. When used as a netlist input to ...

This document is a tool for a customer or supplier organization's internal audit group to assess a statistical process control (SPC) system against the requirements of IPC-9191. This tool can be ...