IPC Standards

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Standard [CURRENT] 1998-05

IPC 2225:1998-05; ANSI/IPC-2225

Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies

Used in conjunction with IPC-2221A, IPC-2225 establishes the requirements and other considerations (thermal, electrical, electromechanical and mechanical) for the design of Single Chip Module ...

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Standard [CURRENT] 2000-01-01

IPC JIEP-0400:2000-01-01

Flame Retardant Article Translation

A Japanese to English translation of the JIEP article by Nobuyuki Honda on Environmentally-Friendly (halogen free) Flame Retardant Resins as originally published in the Japan Institute for ...

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Standard [CURRENT] 1999-11-01

IPC 9191:1999-11-01

General Guidelines for Implementation of Statistical Process Control (SPC)

ANSI Approved. IPC-9191 reflects the principals of statistical process control (SPC) represented by ISO/DIS 11462-1, Guidelines for Implementation of Statistical Process Control (SPC) -- Part 1 ...

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Standard [CURRENT] 1999-05-09

IPC 4104:1999-05-09

Specification for High Density Interconnect (HDI) and Microvia Materials

Covers the various conductive and dielectric materials that can be used for the fabrication of HDI and microvias. The 23 specification sheets included in IPC/JPCA-4104 cover the qualification and ...

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Standard [CURRENT] 1998-02-01

IPC 6015:1998-02-01

Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures

Establishes the specific requirements for organic mounting structures used to interconnect chip components, which in combination form the completed functional organic single-chip module (SCM-L) or ...

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Standard [CURRENT] 1995-08-01

IPC D-351:1995-08-01

Printed Board Drawings in Digital Form

Describes an intelligent, digital format for transfer of drawings between printed wiring board designers, manufacturers and customers. Also conveys additional requirements, guidelines and examples ...

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Standard [CURRENT] 1995-01-01

IPC CA-821:1995-01-01

General Requirements for Thermally Conductive Adhesives

Covers requirements and test methods for thermally conductive dielectric adhesives used to bond components in place. Permanent, removable and self-shimming adhesives are addressed. 18 pages.

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Standard [CURRENT] 1995-01-01

IPC D-355:1995-01-01

Printed Board Automated Assembly Description in Digital Form

Describes an intelligent, digital data transfer format for describing component mounting information. Supplements IPC-D-350 and is for designers and assemblers. Data included are pin location ...

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Standard [CURRENT] 1994-12-31

IPC TP-1113:1994-12-31

Circuit Board Ionic Cleanliness Measurement: What Does it Tell Us?

A Technical Paper discussing ionic cleanliness measurement, testing methods and cleanliness standards in relation to product reliability. Also includes a brief discussion of no-clean fluxes. 8 pages.

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Standard [CURRENT] 1994-07-01

IPC ML-960:1994-07-01

Qualification and Performance Specification for Mass Lamination Panels for Multilayer printed Boards

This specification covers qualification and performance requirements of rigid mass laminated panels for use in multilayer printed boards. Testing procedures and criteria are addressed. 21 pages.

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