Lead-free electronics continues to be a concern of the aerospace, defense, and high performance products (ADHP) industries. This is primarily due to the lack of data and knowledge to: thoroughly ...

IPC-2222B used in conjunction with IPC-2221, establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures.

This document provides useful and practical information for developing thermal profiles to produce acceptable SnPb and Pb-free electronics assemblies using reflow, vapor phase, laser, selective ...

IPC-1402 standard applies to cleaning products used in the Electronics Manufacturing, including but not limited to original equipment manufacturers, electronics manufacturing services companies ...

IPC-7092A standard describes the design, materials and assembly challenges associated with implementing embedded circuitry into a printed board. IPC-7092A covers various aspects of embedded ...

IPC-2292A standard establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on flexible substrates.

Pb-free materials are considered a major technology disruption to traditional Pb-based interconnect materials for electronics, which is of particular concern for the aerospace & defense industries ...

The IPC-6013EM Addendum, when required by procurement documentation/drawings, supplements or replaces specifically identified requirements of IPC-6013E, for flexible/rigid-flexible printed boards ...

IPC-7526A handbook addresses understencil cleanliness during stencil printing, removal of solder paste from stencils following the cleaning process and misprint PCB board cleaning considerations.

The IPC-9701B standard establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies. The surface mount devices may ...