Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits; Supplement 1: Extract of the terms

Technical rule [WITHDRAWN]

DIN EN 60191-3 Beiblatt 1:2003-04

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits; Supplement 1: Extract of the terms

German title
Mechanische Normung von Halbleiterbauelementen - Teil 3: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen für integrierte Schaltungen; Beiblatt 1: Zusammenfassung der Begriffe
Publication date
2003-04
Original language
German
Pages
6

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Publication date
2003-04
Original language
German
Pages
6
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Replacement amendments

This document replaces DIN EN 60191-3 Beiblatt 1:2002-04 .

This document has been replaced by: DIN EN 60191-3 Beiblatt 1:2006-08 .

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