Energie- und Elektrotechnik

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  • Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (IEC 60068-2-69:2017 + COR1:2018 + A1:2019); German version EN 60068-2-69:2017 + AC:2018 + A1:2019

    Standard [CURRENT] 2020-03

    DIN EN 60068-2-69:2020-03; VDE 0468-2-69:2020-03

    Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (IEC 60068-2-69:2017 + COR1:2018 + A1:2019); German version EN 60068-2-69:2017 + AC:2018 + A1:2019

    124.24 EUR VAT included

    116.11 EUR VAT excluded

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  • Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification; interface coordination dimensions for the 25 mm equipment practice (IEC 60917-2:1992); German version EN 60917-2:1994

    Standard [CURRENT] 1994-09

    DIN EN 60917-2:1994-09

    Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification; interface coordination dimensions for the 25 mm equipment practice (IEC 60917-2:1992); German version EN 60917-2:1994

    from 74.80 EUR VAT included

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  • Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (IEC 61188-6-1:2021); German version EN IEC 61188-6-1:2021

    Standard [CURRENT] 2022-08

    DIN EN IEC 61188-6-1:2022-08

    Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (IEC 61188-6-1:2021); German version EN IEC 61188-6-1:2021

    from 130.90 EUR VAT included

    from 122.34 EUR VAT excluded

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  • Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) (IEC 61188-6-2:2021); German version EN IEC 61188-6-2:2021

    Standard [CURRENT] 2023-03

    DIN EN IEC 61188-6-2:2023-03

    Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) (IEC 61188-6-2:2021); German version EN IEC 61188-6-2:2021

    from 124.80 EUR VAT included

    from 116.64 EUR VAT excluded

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  • Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 61188-6-3:2024); German version EN IEC 61188-6-3:2025

    Standard [PRE-ORDER] 2026-07

    DIN EN IEC 61188-6-3:2026-07

    Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 61188-6-3:2024); German version EN IEC 61188-6-3:2025

    from 130.90 EUR VAT included

    from 122.34 EUR VAT excluded

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  • Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 91/1700/CD:2021); Text in German and English

    Draft standard 2022-04

    DIN EN IEC 61188-6-3:2022-04 - Draft

    Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 91/1700/CD:2021); Text in German and English

    Information

    To be withdrawn in 2026-07 and replaced by: DIN EN IEC 61188-6-3, edition:2026-07

    from 112.80 EUR VAT included

    from 105.42 EUR VAT excluded

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  • Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design (IEC 61188-6-4:2019); German version EN IEC 61188-6-4:2019

    Standard [CURRENT] 2020-04

    DIN EN IEC 61188-6-4:2020-04

    Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design (IEC 61188-6-4:2019); German version EN IEC 61188-6-4:2019

    from 149.80 EUR VAT included

    from 140.00 EUR VAT excluded

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  • Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (IEC 61188-7:2017); German version EN 61188-7:2017

    Standard [CURRENT] 2017-12

    DIN EN 61188-7:2017-12

    Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (IEC 61188-7:2017); German version EN 61188-7:2017

    The purpose of this standard is to establishes a consistent technique for the description of electronic component orientation, and their land pattern geometries. This facilitates and encourages a ...

    from 112.80 EUR VAT included

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  • Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials (IEC 61189-2-501:2022); German version EN IEC 61189-2-501:2022

    Standard [CURRENT] 2023-12

    DIN EN IEC 61189-2-501:2023-12

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials (IEC 61189-2-501:2022); German version EN IEC 61189-2-501:2022

    from 105.20 EUR VAT included

    from 98.32 EUR VAT excluded

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  • Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning (IEC 61189-2-630:2018); German version EN IEC 61189-2-630:2018

    Standard [CURRENT] 2019-03

    DIN EN IEC 61189-2-630:2019-03

    Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning (IEC 61189-2-630:2018); German version EN IEC 61189-2-630:2018

    from 67.70 EUR VAT included

    from 63.27 EUR VAT excluded

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