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IEC 60749-20:2008-12
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
- German title
- Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20: Beständigkeit kunststoffverkappter oberflächenmontierbarer Bauelemente gegenüber der kombinierten Beanspruchung durch Feuchtigkeit und Lötwärme
- Publication date
- 2008-12
- Original language
- English, French
- Pages
- 53
- Publication date
- 2008-12
- Original language
- English, French
- Pages
- 53
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