Standard [CURRENT] Article is not orderable
IEC 60749-20:2002-09
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
- German title
- Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20: Beständigkeit kunststoffverkappter oberflächenmontierbarer Bauelemente (SMD) gegenüber der kombinierten Beanspruchung von Feuchte und Lötwärme
- Publication date
- 2002-09
- Original language
- English, French
- Pages
- 49
- Publication date
- 2002-09
- Original language
- English, French
- Pages
- 49
Loading recommended items...
Product information on this site:
Quick delivery via download or delivery service
Buy securely with a credit card or pay upon receipt of invoice
All transactions are encrypted
Replacement amendments
This document has been modified by: IEC 60749-20 Corrigendum 1:2003-08
Loading recommended items...