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IEC 60749-37:2008-01

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer

German title
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 37: Prüfverfahren Fall der Leiterplatte unter Verwendung eines Beschleunigungs-Messgerätes
Publication date
2008-01
Original language
English, French
Pages
39
Publication date
2008-01
Original language
English, French
Pages
39
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