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IEC 61189-5-2:2015-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods materials and assemblies - Soldering flux for printed board assemblies

German title: Prüfverfahren für Elektromaterialien, Verbindungsstrukturen und Baugruppen - Teil 5-2: Prüfverfahren für bestückte Leiterplatten: Teil Lötflussmittel
Publication date: 2015-01
Original language: English, French
Pages: 83

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