Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations

Standard [CURRENT]

IPC TR-486:2001-07-17

Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations

Publication date
2001-07-17
Original language
English
Pages
51

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Publication date
2001-07-17
Original language
English
Pages
51
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Short description

This technical report provides full detail of the round robin study charged with assessing the use of Interconnect Stress Test (IST) as a test for incoming inspection in lieu of Thermal Stress in the detection of innerlayer separations in plated-through holes. Includes background on the Post Separation Task Group, test results, round robin test plan, conclusions and test methods used. 51 pages. Released July 2001. Included in the IPC-C-105 and the IPC-C-1000 Collections.
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