Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method (( IEC 61189-2-808:2024) EN IEC 61189-2-808:2024) (german version)

Standard [CURRENT]

OVE EN IEC 61189-2-808:2025-09-01

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method (( IEC 61189-2-808:2024) EN IEC 61189-2-808:2024) (german version)

German title
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 2-808: Thermischer Widerstand der dielektrischen Schicht durch thermische transiente Methode (( IEC 61189-2-808:2024) EN IEC 61189-2-808:2024) (deutsche Fassung)
Publication date
2025-09-01
Accessibility
Original language
German
Pages
24

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Publication date
2025-09-01
Original language
German
Pages
24
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